What We Do >> Business & Technology

Business & Techonology

Using only the most sophisticated technologies in manufacturing, as well as in testing and functional analysis, SVI easily establishes a competitive edge over its rivals. Its excellent business infrastructures is backed by a process-based approach to developing, implementing and improving quality management systems for enhancement customer satisfaction.

SVI offers an exceptional level of product quality and services, and builds strong, long-term partnerships with key customers in Scandinavia , North Europe and America. A full-turnkey EMS company it provides a full box-build products and system build.

SVI's innovative engineering services enable you to consolidate your engineering requirements. With the depth of experience required to support your products throughout their entire life cycle, we can improve product performance, decrease time-to-market and lower overall product development costs.

SVI's world-class reliability services provide advanced manufacturing failure analysis as well as mechanical and reliability testing. Our strategic network enables us to use our internal, local resources and unique equipment to provide the widest selection of test technologies and expertise.

  • Advanced SMT lines with DEK Horizon Series Screen Printers, High-Speed Mounters such as the high-end Hitachi GXH series, Fuji and Siemens, and 10-zone Convection Reflow Ovens
  • In-line and Off-line Solder Paste Inspection
  • In-line Post Mounter Automated Optical Inspection and Post Reflow Automated Optical Inspection
  • X-Ray Inspection for BGA, Flip Chip and Fine-Pitch Component
  • 0201 Chips, CSP, BGA, µBGA and 80-micron bump Flip Chip capability
  • BGA rework and re-ball capability
  • Automated Axial and Radial Insertion
  • Through Hole Soldering including Wave Soldering with No-Clean or Water-soluble Flux for both Lead and Lead-free products
  • Aqueous cleaning
  • Ionic Contamination for cleanliness control
  • Fully Automated Wire Bonding capability
  • Fine-pitch COB by K&S Wire Bonder
  • Large board COB by ASM machine
  • Conventional In-Circuit Test
  • Test Jet & Boundary Scan Technology by HP Series
  • Flying Probe and Optical Inspection by GENRAD GR Pilot
  • Low-Cost In-Circuit Test by MDA
  • Functional Tester fabrication capability
  • Test Equipment that support diversified product applications
    • Network Analyzer 6 GHz
    • Spectrum Analyzer 26 GHz
    • Noise Figure Measurement 26 GHz
    • Digital Oscilloscopes
    • Programmable Function Generators
    • Standard Calibration Equipments
    • Worth 600 Customized Tester
    • Digital Multi-meters
    • Frequency Counters
    • Audio & Distortion Analyzer
    • Hi-Pot Testers
    • LRC-Meters
    • Q-Test Meters
  • Up to 26 GHz for Test Set of Agilent Spectrum Analyzer, Noise Figure Measurement System, Network Analyzer, and Power Meter
  • Static and Dynamic Burn-In Test
  • Dynamic Temperature Cycling Test
  • Humidity Test
  • ESS Chamber, Thermal Cycling Chamber
  • Temperature/Humidity Chamber
  • Temperature Shock Chamber
  • Vibration Test System
  • Cross Section Analysis
  • X-Ray Plating Measurement
  • High Power Microscope 1000x
  • Temperature Profile Measurement
  • Laser Section Microscope
  • ERSA Scope
  • Viscosity Meter
  • Thermo Hydro Meter
  • Ionic Contamination Meter
  • Profile Projector
  • Tape and Reel Capability
  • De-panel process with Automatic Router
  • Conformal Coating
  • Potting
  • Ultrasonic Welding
  • Hot Bar Soldering
  • Box Build Assembly

Our active participation in industry associations and affiliation with academic institutions enables us to help establish industry standards and share best practices.

With decades of experience in manufacturing and R&D, we can offer our customers exceptional expertise in:

  • Mechanical stress - product verification
  • Mechanical testing including shock, vibration
  • Thermo-mechanical reliability test design
  • Reliability testing, consulting, measurement
  • RoHS (Restriction of Hazardous Substances) second-level assembly qualification, lead-free soldering
  • Optical microscopy with digital image analysis
  • Component failure analysis
  • Failure analysis of electronic assemblies